Professor David Stephenson and Dr Jin Tan
Analysis of Grinding Chip Temperature and Energy Partitioning in High-Efficiency Deep Grinding
Abstract
A new approach is introduced to refine the analysis for the chip energy in the high efficiency deep grinding process, by considering the heat partitioning at the chip formation area. The analysis for the chip-work subsystem has been combined with the whole thermal system to derive the grinding temperature on the workpiece surface. The variation of chip temperature with material removal rate under different grinding conditions was investigated, and the relationship between the chip temperature and workpiece contact temperature was derived. The grinding temperatures obtained using different approaches were compared with 'measured temperatures', estimated from the depth of thermal damage observed on ground samples.
Published in:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture Volume - Volume 220 Issue - 5 First Page - 615 Last Page - 625 Issue Cover Date - 2006-01-01
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Richard Woods, Tin Jan and Professor David Stephenson at the Manufacturing Industries AGM held on 13 September 2007. |
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